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Laser Micromachining Product List and Ranking from 10 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Laser Micromachining Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 光機械製作所 HIKARI LASER LAB. Mie//Manufacturing and processing contract
  2. ナラサキ産業 メカトロソリューション部　機能材料課 Tokyo//Manufacturing and processing contract
  3. リプス・ワークス Tokyo//Manufacturing and processing contract
  4. アルプスエンジニアリング Shizuoka//Industrial Machinery
  5. 5 シーエステック Kyoto//Resin/Plastic
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Laser Micromachining Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Ultrafine! Introduction to Laser Processing ナラサキ産業 メカトロソリューション部　機能材料課
  2. Examples of dimple processing for punches リプス・ワークス
  3. Laser microprocessing: carbide chip breaker (groove) processing 光機械製作所 HIKARI LASER LAB.
  4. 【ガラス　合成石英ガラス　レーザー改質　くり抜き加工】 光機械製作所 HIKARI LASER LAB.
  5. Laser microfabrication: Glass hole processing, fine holes 光機械製作所 HIKARI LASER LAB.

Laser Micromachining Product List

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Ultrafine! Introduction to Laser Processing

Ultrafine! Introduction to Laser Processing

It is possible to process fine pores of about a few microns to 20 microns and perform micro machining.

By using ultra-short pulse lasers with a duration of less than picoseconds, we achieve processing with extremely minimal thermal damage to the surrounding area. - Non-thermal - Non-contact - High precision - Dry processing Additionally, we can perform fine processing on various materials: - Diamond = hard - Glass = brittle - Plastic = soft - CFRP = composite We process a wide range of materials. By utilizing high-output laser processing machines, we offer a selection of processing materials that is unmatched by other companies, allowing us to take on all kinds of fine processing challenges. Furthermore, we can modify surfaces and apply water-repellent treatments, and we accept contract processing starting from a single prototype. When you request our services, we can prepare materials in various patterns, from test pieces of high-performance materials to products processed based on drawings. Please feel free to consult with us first.

  • Processing Contract
  • Fine Ceramics
  • Other processing machines

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Laser microfabrication

Laser microfabrication

Numerous achievements in the research field! Laser technology capable of fine processing of polymer materials with adhesive properties.

CSTEC's laser microfabrication allows for processing with high precision and minimal burr formation, making it suitable for processing resin materials that may crack when punched. Fine patterns and naming can be applied to parts and other items. With four-wavelength laser microfabrication, higher quality processing has become possible. We offer fine contract processing, prototyping, and mass production services for researchers and design engineers. 【Features】 ■ Capable of microfabrication on difficult-to-process adhesive polymer materials ■ Reduces burrs on the processed cross-section with low thermal impact photodecomposition processing ■ Can accommodate from one piece without the need for molds, ideal for prototyping evaluation ■ Cost-effective mass production through a combination of laser processing and mold punching ■ Higher quality processing made possible with four-wavelength laser microfabrication *For more details, please refer to the PDF materials or feel free to contact us.

  • Laser marker
  • Processing Contract
  • Surface treatment contract service

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Examples of dimple processing for punches

Examples of dimple processing for punches

We achieved dimple processing without introducing dimensional errors to the high-precision machined punch surface.

From the perspective of resource conservation, energy saving, and guaranteeing machine performance, improving the characteristics and friction behavior of friction surfaces is essential. Additionally, the amount and frequency of lubrication in breaking and plastic processing are important from the standpoint of process improvement. Our company has achieved a dimple processing method that serves as a reservoir for oil, enabling continuous processing and lubrication with minimal oil quantity, without introducing dimensional errors to the precisely machined surfaces.

  • Other consumables

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Realization of anisotropic structural colors using nanoperiodic structures (LIPSS)

Realization of anisotropic structural colors using nanoperiodic structures (LIPSS)

We will introduce the application of femtosecond lasers for the creation of nano-periodic structures.

At Lips Works, we have successfully controlled the directionality of LIPSS (nano-periodic structures) using femtosecond laser processing. By selectively changing the directionality of the nano-periodic structures, it is possible to create patterns with different emission colors side by side. With the completion of this technology, we can freely apply nano-periodic structures with different orientations. As shown in the photo, various emissions can be observed. Nano-periodic structures reflect the wavelength components contained in light as they are, depending on the angle of incidence from a certain direction. This is a proposal for processing that utilizes the reflection of fine structures to achieve decorative properties.

  • Processing Contract

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High-speed dicing of difficult-to-process materials such as SiC and glass - TLS-Dicing

High-speed dicing of difficult-to-process materials such as SiC and glass - TLS-Dicing

High-speed cutting of extremely difficult-to-process materials like "SiC and glass" is possible! A technology essential for the spread of EVs!

With the spread of EVs (electric vehicles) and the increase in power consumption due to network connections between electronic devices, there is a growing demand for semiconductors that can handle higher output and higher current. "Power semiconductors" using next-generation semiconductor materials such as SiC are gaining attention. However, the processing of hard and brittle SiC requires advanced technology. Traditional mechanical and laser cutting methods face many issues, such as slow processing speeds, chipping, a wide cutting width leading to reduced production volume, and the inability to cut electrode surfaces. Our laser micro-processing technology, "TLS-Dicing," utilizes thermal stress from temperature differences between heating and cooling, enabling high-speed cutting even for difficult-to-process materials like SiC and glass. It can be utilized in various industries that handle hard-to-cut semiconductor materials. *Actual processing photos and data for difficult-to-cut materials and hard brittle materials can be downloaded and viewed from the link below.

  • Company：光
  • Price：Other
  • Processing Contract

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Ultra-fine processing using the latest technology with lasers!

Ultra-fine processing using the latest technology with lasers!

Contract processing! We respond to various processing requests such as ultra-fine hole drilling, groove processing, thin film peeling, and fine marking.

■Micromachining down to several tens of microns → High-quality processing is possible with state-of-the-art machining equipment ■Non-thermal processing is possible → Processing without thermal effects, as the irradiation stops before heat spreads → No molten parts, so there are no burrs. Edges are finished sharply ■Compatible with various materials → Broad compatibility with aluminum, copper alloys, various metals, plastics, ceramics, glass, and more For processing examples and details, please visit our website! https://www.ebtohoku.co.jp/result/laser/

  • Processing Contract

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[New Application Recruitment] Solving Issues with Anti-adhesion Coating × Laser Microprocessing

[New Application Recruitment] Solving Issues with Anti-adhesion Coating × Laser Microprocessing

We will fulfill your desire for finely processed products that are resistant to dirt.

We offer the following processing services based on the technology cultivated in electronic component manufacturing: - Original surface treatment (coating) - Laser fine processing technology 【Features of Processing Technology】 ■ Original Surface Treatment (Coating): Product name "JC Coat P" - Thin film (up to 1μm) allows for no need for redesign considering the coating - Strong adhesion to the substrate makes it difficult to peel off, eliminating concerns about foreign matter contamination. - Has a hardness approximately 4-5 times that of stainless steel - Complies with domestic regulations for food contact materials ■ Laser Fine Processing Technology - High-precision hole processing with ±0.003mm accuracy - Minimum opening of Φ0.008mm and above - High aspect ratio of over 10 is possible, including slit processing By leveraging each of these strengths, we can solve various challenges. If you are interested in: - "Wanting to perform fine processing" - "Not wanting to contaminate fine processed products" - "Wanting to apply, discharge, and supply stably from fine holes or slits" please feel free to consult with us. We also accommodate inquiries for each service individually. 【Examples of Applications】 Metal masks for solder printing - Achieves stable solder volume, reduced bleeding, and minimized residue, resulting in high-quality printing.

  • Surface treatment contract service
  • Processing Contract

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Laser microfabrication: Glass hole processing, fine holes

Laser microfabrication: Glass hole processing, fine holes

Laser shape processing: Trimming long holes in glass (quartz).

Material: Glass (Quartz) / Thickness 0.15mm A long hole with a width of 0.5mm has been trimmed into the glass thin plate. It is possible to shape fine holes. Fine processing of glass, such as cutting and trimming of thin and fragile glass plates, is possible.

  • Glass
  • Processing Contract
  • Other semiconductors

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Laser microfabrication: Titanium hexagonal trimming processing with fine holes.

Laser microfabrication: Titanium hexagonal trimming processing with fine holes.

Laser shape processing: Trimming hexagons from difficult-to-machine titanium.

We have trimmed hexagonal holes into a thin sheet of highly biocompatible titanium. It is possible to shape fine holes. With a narrow remaining width, we can achieve fine processing with minimal burrs even for complex shapes. Material: Titanium Thickness: 0.2mm Size: Opening 200μm Shape: Hexagonal hole

  • Processing Contract
  • alloy
  • Lithium-ion battery

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Microfabrication, nickel, hexagonal, trimming process, micro holes.

Microfabrication, nickel, hexagonal, trimming process, micro holes.

Laser fine shape processing: Nickel hexagonal trimming processing

Trimming processing was performed on nickel thin plates with a short-pulse laser, creating hexagonal holes. It is possible to shape fine holes. With non-thermal processing using a short-pulse laser, even difficult-to-cut materials can be finely processed with minimal burrs, even for complex shapes and narrow residual widths. While conventional machining imposes significant stress on the workpiece, leading to distortion and thermal effects that make it difficult to work with certain materials, short-pulse lasers can handle these challenges. Material: Nickel / Thickness: 200μm Hexagonal hole: Opening 200μm

  • Processing Contract
  • Evaporation Equipment
  • Engine parts

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Laser microprocessing, glass processing, internal modification, marking.

Laser microprocessing, glass processing, internal modification, marking.

Laser microfabrication: Achieving internal modification of glass through processing to enable marking within the glass.

【Laser Micromachining Glass Processing Internal Modification Marking】 【Material】 Glass 【Industry/Application】 Medical parts-related industry 【Processing】 Ultrafast pulse laser processing 【Features】 This product underwent internal modification processing without damaging the glass surface using an ultrafast pulse laser. Since marking was performed inside the glass, it will not wear away. By using an ultrafast pulse laser, physical damage and thermal effects are significantly minimized, allowing for fine processing with minimal burrs. ◆ Micromachining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We take care of everything from processing to equipment setup. Hikari Kikai Seisakusho Co., Ltd. ■ HIKARI LASER LAB. 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Processing Contract
  • Laser marker
  • Glass

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Laser micromachining, fine trimming processing, copper, Cu, fine holes.

Laser micromachining, fine trimming processing, copper, Cu, fine holes.

Laser microfabrication: Ultra-fine long holes were trimmed into copper.

【Laser Micromachining Micro Trimming Processing Copper Cu Micro Holes】 【Material】 Copper (Cu) 【Material Dimensions】 Thickness 0.1mm (100μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product achieves micro trimming processing on 0.1mm thick copper. The residual allowance between the long holes is 50μm, which is very fine. Copper is a material that is easily affected by heat, but by selecting the wavelength of the ultrashort pulse laser, it is possible to process fine shapes with reduced thermal effects. Physical damage and thermal effects are significantly minimized, resulting in fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hik

  • Processing Contract
  • Other semiconductor manufacturing equipment
  • Non-ferrous metals

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Micro holes CFRP composite material micro machining

Micro holes CFRP composite material micro machining

Laser microprocessing: fine holes, CFRP, composite materials, microprocessing

【Micro Holes CFRP Composite Material Micro Machining】 【Material】 Composite Material CFRP 【Dimensions】 Hole Diameter 0.1mm Thickness 0.1mm 【Processing】 Ultra Short Pulse Laser Processing 【Features】 Drilling processing is performed on CFRP material. In mechanical processing, issues such as fiber entanglement and fiber breakage due to tool engagement can occur, but using a non-contact laser allows for processing without compromising functionality. The use of ultra-short pulse lasers minimizes physical damage and thermal effects, enabling fine machining with minimal burrs. ◆ Fine machining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Processing Contract
  • Contract manufacturing
  • Brake parts

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Microfabrication Company Logo Ultra-short Pulse Laser Thin Film Material

Microfabrication Company Logo Ultra-short Pulse Laser Thin Film Material

Marking on aluminum thin films using ultrashort pulse lasers.

【Microfabrication Company Logo Mark Ultra-Short Pulse Laser Thin Film Material】 【Material】 Aluminum foil Thickness: 11μm 【Industry and Application】 Automotive industry Medical devices and medical parts industry Semiconductors and electronic components 【Dimensions】 Processing size: 3mm x 3mm square range 【Processing】 Ultra-short pulse laser processing 【Features】 This product features a company logo mark laser processed onto aluminum thin film material. Due to its thickness of 11μm, it is less likely to be affected by heat, allowing for clean processing.

  • Other electronic parts

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Micro glass groove processing, contract processing, micro channels, medical parts.

Micro glass groove processing, contract processing, micro channels, medical parts.

Fine groove processing on the surface of glass materials is possible through contract processing.

【Material and Processing】 Glass, Microchannel, Groove width 200μm 【Features】 This product can process not only straight grooves but also curved microchannels in glass using ultrashort pulse lasers. 【Industry and Applications】 Automotive industry Medical devices and medical parts industry Semiconductors and electronic components

  • Glassware and containers

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