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Laser Micromachining Product List and Ranking from 10 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

Laser Micromachining Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. 光機械製作所 HIKARI LASER LAB. Mie//Manufacturing and processing contract
  2. 光 Kanagawa//Trading company/Wholesale
  3. 東成イービー東北 Fukushima//Manufacturing and processing contract
  4. 4 マイクロエッヂプロセス Kanagawa//Manufacturing and processing contract
  5. 5 ナラサキ産業 メカトロソリューション部　機能材料課 Tokyo//Manufacturing and processing contract
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Laser Micromachining Product ranking

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. High-speed dicing of difficult-to-process materials such as SiC and glass - TLS-Dicing 光
  2. Ultra-fine processing using the latest technology with lasers! 東成イービー東北
  3. Laser microfabrication, water repellency, release properties, surface modification, metal, resin. 光機械製作所 HIKARI LASER LAB.
  4. Laser microfabrication: Titanium hexagonal trimming processing with fine holes. 光機械製作所 HIKARI LASER LAB.
  5. 4 Laser microfabrication of the micro-edge process マイクロエッヂプロセス

Laser Micromachining Product List

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Ultrafine! Introduction to Laser Processing

Ultrafine! Introduction to Laser Processing

It is possible to process fine pores of about a few microns to 20 microns and perform micro machining.

By using ultra-short pulse lasers with a duration of less than picoseconds, we achieve processing with extremely minimal thermal damage to the surrounding area. - Non-thermal - Non-contact - High precision - Dry processing Additionally, we can perform fine processing on various materials: - Diamond = hard - Glass = brittle - Plastic = soft - CFRP = composite We process a wide range of materials. By utilizing high-output laser processing machines, we offer a selection of processing materials that is unmatched by other companies, allowing us to take on all kinds of fine processing challenges. Furthermore, we can modify surfaces and apply water-repellent treatments, and we accept contract processing starting from a single prototype. When you request our services, we can prepare materials in various patterns, from test pieces of high-performance materials to products processed based on drawings. Please feel free to consult with us first.

  • Processing Contract
  • Fine Ceramics
  • Other processing machines
  • Laser Micromachining

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Laser microfabrication

Laser microfabrication

Numerous achievements in the research field! Laser technology capable of fine processing of polymer materials with adhesive properties.

CSTEC's laser microfabrication allows for processing with high precision and minimal burr formation, making it suitable for processing resin materials that may crack when punched. Fine patterns and naming can be applied to parts and other items. With four-wavelength laser microfabrication, higher quality processing has become possible. We offer fine contract processing, prototyping, and mass production services for researchers and design engineers. 【Features】 ■ Capable of microfabrication on difficult-to-process adhesive polymer materials ■ Reduces burrs on the processed cross-section with low thermal impact photodecomposition processing ■ Can accommodate from one piece without the need for molds, ideal for prototyping evaluation ■ Cost-effective mass production through a combination of laser processing and mold punching ■ Higher quality processing made possible with four-wavelength laser microfabrication *For more details, please refer to the PDF materials or feel free to contact us.

  • Laser marker
  • Processing Contract
  • Surface treatment contract service
  • Laser Micromachining

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Examples of dimple processing for punches

Examples of dimple processing for punches

We achieved dimple processing without introducing dimensional errors to the high-precision machined punch surface.

From the perspective of resource conservation, energy saving, and guaranteeing machine performance, improving the characteristics and friction behavior of friction surfaces is essential. Additionally, the amount and frequency of lubrication in breaking and plastic processing are important from the standpoint of process improvement. Our company has achieved a dimple processing method that serves as a reservoir for oil, enabling continuous processing and lubrication with minimal oil quantity, without introducing dimensional errors to the precisely machined surfaces.

  • Other consumables
  • Laser Micromachining

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Realization of anisotropic structural colors using nanoperiodic structures (LIPSS)

Realization of anisotropic structural colors using nanoperiodic structures (LIPSS)

We will introduce the application of femtosecond lasers for the creation of nano-periodic structures.

At Lips Works, we have successfully controlled the directionality of LIPSS (nano-periodic structures) using femtosecond laser processing. By selectively changing the directionality of the nano-periodic structures, it is possible to create patterns with different emission colors side by side. With the completion of this technology, we can freely apply nano-periodic structures with different orientations. As shown in the photo, various emissions can be observed. Nano-periodic structures reflect the wavelength components contained in light as they are, depending on the angle of incidence from a certain direction. This is a proposal for processing that utilizes the reflection of fine structures to achieve decorative properties.

  • Processing Contract
  • Laser Micromachining

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High-speed dicing of difficult-to-process materials such as SiC and glass - TLS-Dicing

High-speed dicing of difficult-to-process materials such as SiC and glass - TLS-Dicing

High-speed cutting of extremely difficult-to-process materials like "SiC and glass" is possible! A technology essential for the spread of EVs!

With the spread of EVs (electric vehicles) and the increase in power consumption due to network connections between electronic devices, there is a growing demand for semiconductors that can handle higher output and higher current. "Power semiconductors" using next-generation semiconductor materials such as SiC are gaining attention. However, the processing of hard and brittle SiC requires advanced technology. Traditional mechanical and laser cutting methods face many issues, such as slow processing speeds, chipping, a wide cutting width leading to reduced production volume, and the inability to cut electrode surfaces. Our laser micro-processing technology, "TLS-Dicing," utilizes thermal stress from temperature differences between heating and cooling, enabling high-speed cutting even for difficult-to-process materials like SiC and glass. It can be utilized in various industries that handle hard-to-cut semiconductor materials. *Actual processing photos and data for difficult-to-cut materials and hard brittle materials can be downloaded and viewed from the link below.

  • Company：光
  • Price：Other
  • Processing Contract
  • Laser Micromachining

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Ultra-fine processing using the latest technology with lasers!

Ultra-fine processing using the latest technology with lasers!

Contract processing! We respond to various processing requests such as ultra-fine hole drilling, groove processing, thin film peeling, and fine marking.

■Micromachining down to several tens of microns → High-quality processing is possible with state-of-the-art machining equipment ■Non-thermal processing is possible → Processing without thermal effects, as the irradiation stops before heat spreads → No molten parts, so there are no burrs. Edges are finished sharply ■Compatible with various materials → Broad compatibility with aluminum, copper alloys, various metals, plastics, ceramics, glass, and more For processing examples and details, please visit our website! https://www.ebtohoku.co.jp/result/laser/

  • Processing Contract
  • Laser Micromachining

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Laser microfabrication: Glass hole processing, fine holes

Laser microfabrication: Glass hole processing, fine holes

Laser shape processing: Trimming long holes in glass (quartz).

Material: Glass (Quartz) / Thickness 0.15mm A long hole with a width of 0.5mm has been trimmed into the glass thin plate. It is possible to shape fine holes. Fine processing of glass, such as cutting and trimming of thin and fragile glass plates, is possible.

  • Glass
  • Processing Contract
  • Other semiconductors
  • Laser Micromachining

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Laser microfabrication: Titanium hexagonal trimming processing with fine holes.

Laser microfabrication: Titanium hexagonal trimming processing with fine holes.

Laser shape processing: Trimming hexagons from difficult-to-machine titanium.

We have trimmed hexagonal holes into a thin sheet of highly biocompatible titanium. It is possible to shape fine holes. With a narrow remaining width, we can achieve fine processing with minimal burrs even for complex shapes. Material: Titanium Thickness: 0.2mm Size: Opening 200μm Shape: Hexagonal hole

  • Processing Contract
  • alloy
  • Lithium-ion battery
  • Laser Micromachining

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Microfabrication, nickel, hexagonal, trimming process, micro holes.

Microfabrication, nickel, hexagonal, trimming process, micro holes.

Laser fine shape processing: Nickel hexagonal trimming processing

Trimming processing was performed on nickel thin plates with a short-pulse laser, creating hexagonal holes. It is possible to shape fine holes. With non-thermal processing using a short-pulse laser, even difficult-to-cut materials can be finely processed with minimal burrs, even for complex shapes and narrow residual widths. While conventional machining imposes significant stress on the workpiece, leading to distortion and thermal effects that make it difficult to work with certain materials, short-pulse lasers can handle these challenges. Material: Nickel / Thickness: 200μm Hexagonal hole: Opening 200μm

  • Processing Contract
  • Evaporation Equipment
  • Engine parts
  • Laser Micromachining

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Laser microprocessing, glass processing, internal modification, marking.

Laser microprocessing, glass processing, internal modification, marking.

Laser microfabrication: Achieving internal modification of glass through processing to enable marking within the glass.

【Laser Micromachining Glass Processing Internal Modification Marking】 【Material】 Glass 【Industry/Application】 Medical parts-related industry 【Processing】 Ultrafast pulse laser processing 【Features】 This product underwent internal modification processing without damaging the glass surface using an ultrafast pulse laser. Since marking was performed inside the glass, it will not wear away. By using an ultrafast pulse laser, physical damage and thermal effects are significantly minimized, allowing for fine processing with minimal burrs. ◆ Micromachining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We take care of everything from processing to equipment setup. Hikari Kikai Seisakusho Co., Ltd. ■ HIKARI LASER LAB. 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Processing Contract
  • Laser marker
  • Glass
  • Laser Micromachining

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Laser micromachining, fine trimming processing, copper, Cu, fine holes.

Laser micromachining, fine trimming processing, copper, Cu, fine holes.

Laser microfabrication: Ultra-fine long holes were trimmed into copper.

【Laser Micromachining Micro Trimming Processing Copper Cu Micro Holes】 【Material】 Copper (Cu) 【Material Dimensions】 Thickness 0.1mm (100μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product achieves micro trimming processing on 0.1mm thick copper. The residual allowance between the long holes is 50μm, which is very fine. Copper is a material that is easily affected by heat, but by selecting the wavelength of the ultrashort pulse laser, it is possible to process fine shapes with reduced thermal effects. Physical damage and thermal effects are significantly minimized, resulting in fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hik

  • Processing Contract
  • Other semiconductor manufacturing equipment
  • Non-ferrous metals
  • Laser Micromachining

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Micro holes CFRP composite material micro machining

Micro holes CFRP composite material micro machining

Laser microprocessing: fine holes, CFRP, composite materials, microprocessing

【Micro Holes CFRP Composite Material Micro Machining】 【Material】 Composite Material CFRP 【Dimensions】 Hole Diameter 0.1mm Thickness 0.1mm 【Processing】 Ultra Short Pulse Laser Processing 【Features】 Drilling processing is performed on CFRP material. In mechanical processing, issues such as fiber entanglement and fiber breakage due to tool engagement can occur, but using a non-contact laser allows for processing without compromising functionality. The use of ultra-short pulse lasers minimizes physical damage and thermal effects, enabling fine machining with minimal burrs. ◆ Fine machining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Processing Contract
  • Contract manufacturing
  • Brake parts
  • Laser Micromachining

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Microfabrication Company Logo Ultra-short Pulse Laser Thin Film Material

Microfabrication Company Logo Ultra-short Pulse Laser Thin Film Material

Marking on aluminum thin films using ultrashort pulse lasers.

【Microfabrication Company Logo Mark Ultra-Short Pulse Laser Thin Film Material】 【Material】 Aluminum foil Thickness: 11μm 【Industry and Application】 Automotive industry Medical devices and medical parts industry Semiconductors and electronic components 【Dimensions】 Processing size: 3mm x 3mm square range 【Processing】 Ultra-short pulse laser processing 【Features】 This product features a company logo mark laser processed onto aluminum thin film material. Due to its thickness of 11μm, it is less likely to be affected by heat, allowing for clean processing.

  • Other electronic parts
  • Laser Micromachining

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Micro glass groove processing, contract processing, micro channels, medical parts.

Micro glass groove processing, contract processing, micro channels, medical parts.

Fine groove processing on the surface of glass materials is possible through contract processing.

【Material and Processing】 Glass, Microchannel, Groove width 200μm 【Features】 This product can process not only straight grooves but also curved microchannels in glass using ultrashort pulse lasers. 【Industry and Applications】 Automotive industry Medical devices and medical parts industry Semiconductors and electronic components

  • Glassware and containers
  • Laser Micromachining

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We processed holes in SUS pipes using fine laser machining!

We processed holes in SUS pipes using fine laser machining!

Fine holes were processed into SUS304 pipes using fine laser machining.

【Industry and Application】 Automotive-related industry Medical devices and medical parts-related industry Precision stainless steel micro parts for medical devices 【Material】 SUS304 (sus304) 【Dimensions】 Pipe outer diameter Φ1.5mm / Through hole diameter Φ0.5mm 【Processing】 Ultrashort pulse laser processing 【Features】 This product has undergone hole processing on a pipe shape made of SUS304 (sus304) material. Our fine laser processing allows for not only flat plate processing but also processing of cylindrical shapes like pipes. Since this product uses ultrashort pulse laser, physical damage and thermal effects are significantly minimized, enabling fine processing with minimal burrs.

  • Other electronic parts
  • Laser Micromachining

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"Laser Micromachining" *Materials with case studies will be provided.

"Laser Micromachining" *Materials with case studies will be provided.

Achieving high-quality precision processing with optical systems tailored to materials and shapes. Consistent support from prototyping to mass production.

Our company conducts prototyping and mass production using "laser microprocessing." Leveraging our knowledge and experience from selling laser processing equipment, we propose optical systems and oscillators that match the materials and processing requirements. Additionally, we can provide comprehensive support in-house for combined processing that incorporates machining and micro-blasting, addressing a wide range of needs from prototyping to mass production. ★ You can view materials showcasing processing examples from the "PDF Download." 【Examples Listed (Excerpt)】 ◎ Laser Drilling Multi-hole processing on ceramics, drilling on tempered glass, and through-hole drilling and counterboring on glass substrates. ◎ Cutting, Grooving, Drilling, Thin Film Removal Grooving on SiC substrates, free-form cutting of polyimide, and cutting out carbon sheets. *Please feel free to contact us with any inquiries.

  • Processing Contract
  • Other processing machines
  • Laser Micromachining

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Case study of fine square hole machining on tungsten (W) using ultrashort pulse laser.

Case study of fine square hole machining on tungsten (W) using ultrashort pulse laser.

This is an introduction to a case of micro-fine square hole processing on a tungsten plate with a thickness of 0.1mm.

【Processing Specifications】 Plate Thickness: 0.1mm Hole Dimensions (Incident Surface): 0.3×0.3mm Pitch: 0.6mm Processing Range: 45×45mm You will see that it has been processed in a very beautiful state with minimal thermal impact, without chipping or cracking. The gap between the square holes is approximately 0.015mm or less, making it a good example of the characteristics of short pulse lasers. Tungsten (W) has an extremely high melting and boiling point and is the material with the lowest coefficient of linear expansion among metals. Additionally, due to its very high hardness, it is well known as a material for cemented carbide. However, it is difficult to process, and in machining, there are challenges such as tool wear and chipping, making it particularly regarded as a material that is difficult for fine processing. Nevertheless, there is a high demand for fine processing, and various methods have been repeatedly challenged, but none of the conventional methods were able to achieve the desired shapes. At Lips Works Co., Ltd., we thoroughly explored the appropriate values for optical systems, control systems, laser power, etc., and finally established beautiful fine processing technology for tungsten. There are no concerns about tool wear or breakage, or variations in quality that are seen in machining or other methods.

  • Processing Contract
  • Laser Micromachining

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Information on "Ultraviolet Laser Micromachining"

Information on "Ultraviolet Laser Micromachining"

Ultraviolet laser micromachining at a wavelength of 266nm!

Our company offers UV laser microprocessing for materials such as metals, resins, and glass. With a focused spot diameter of 15 to 20 μm, it is capable of processing transparent resin films due to the wavelength of 266 nm. Additionally, compared to cutting and discharge methods, the setup is simpler, allowing for short lead times and low costs depending on the shape. 【Processing Details】 ■ Materials: Metals, resins, glass, etc. ■ Processing Accuracy: Galvano scan range approximately ±0.03 mm in the XY direction (depends on material and shape) *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Laser Micromachining

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Laser microfabrication of the micro-edge process

Laser microfabrication of the micro-edge process

We are conducting daily research and development on processing that is believed to be difficult with existing methods, such as fine shapes and special materials.

In the micro-edge process, we offer "laser fine processing." Focusing on micro joining, micro drilling, and ablation, we utilize suitable processing methods such as discharge machining and cutting, tailored to our customers' specifications and applications, enabling us to assist from single prototype production to mass production. Additionally, using our unique technology, we adopt appropriate measurement and observation methods that take these influences into account. Please feel free to entrust us with your needs. 【Processing Shapes】 ■ Welding, build-up ■ Fine holes (pinholes) ■ Deep holes, stop holes, high aspect ratio holes ■ Long holes, grooves, high aspect ratio slits ■ Precision cutting *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Laser Micromachining

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Laser microprocessing: carbide chip breaker (groove) processing

Laser microprocessing: carbide chip breaker (groove) processing

Laser microprocessing: carbide chip breaker (groove) processing

Grooves were processed at the tip of a carbide cutting tool using an ultra-short pulse laser. This improves the discharge of "chips" generated during cutting and maintains a good cutting condition. It is also possible to process materials such as PCD (polycrystalline diamond) and CBN (polycrystalline cubic boron nitride). In this way, by applying fine processing with a laser, it is also possible to enhance functionality. Material: Carbide

  • Processing Contract
  • Other machine tools
  • Drive system parts
  • Laser Micromachining

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Laser microprocessing: Chip breaker (groove) processing

Laser microprocessing: Chip breaker (groove) processing

Micro chip breaker (groove) processing for PCD (polycrystalline diamond sintered body)

The tip of the PCD cutting tool was grooved using an ultra-short pulse laser. This improves the discharge of "cutting chips" generated during cutting and maintains a good cutting condition. It is also possible to process materials such as carbide and CBN (cubic boron nitride). Chip breaker (groove) processing Material: PCD (polycrystalline diamond sintered body) Breaker width: 600 μm

  • Processing Contract
  • byte
  • Other cutting tools
  • Laser Micromachining

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Laser microfabrication, water repellency, release properties, surface modification, metal, resin.

Laser microfabrication, water repellency, release properties, surface modification, metal, resin.

Surface modification: Hydrophobicity can be imparted through nano-patterning processing.

【Laser Micromachining Hydrophobicity Release Properties Surface Modification Metal Resin】 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product has been modified using ultrashort pulse laser micromachining to impart hydrophobicity to the metal surface. It is also referred to as functional processing, which adds functionality and enhances the product's performance. While hydrophobicity has been added this time, applications such as "hydrophilicity," "friction reduction," and "sliding properties" are also possible, contributing to the improvement of product functionality. It is a technology that utilizes the lotus effect. ◆ Micromachining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We take care of everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Processing Contract
  • Engine parts
  • Drive system parts
  • Laser Micromachining

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Laser microfabrication, glass marking, application in the medical industry.

Laser microfabrication, glass marking, application in the medical industry.

Laser microprocessing: Marking processing on glass surfaces

【Laser Microprocessing Glass Marking Applied to the Medical Industry】 【Material】 Glass 【Industry and Application】 Medical devices and related components 【Processing】 Ultrafast pulse laser processing 【Features】 This product performs fine marking on the glass surface with a Φ0.1mm spot using an ultrafast pulse laser. (Compliant with SEMI format) Since this product uses an ultrafast pulse laser, physical damage and thermal effects are minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We take care of it all. From processing to equipment setup. Hikari Kikai Seisakusho Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Higashi-Kashi Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture, 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Laser marker
  • Processing Contract
  • Sealing machine
  • Laser Micromachining

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Microfabrication, trimming process, SUS304, laser, cutting out.

Microfabrication, trimming process, SUS304, laser, cutting out.

Laser microfabrication: trimming process SUS304 laser cutting

【Microfabrication Trimming Processing SUS304 Laser Cutting】 【Material】 SUS304 【Material Dimensions】 Thickness 0.05mm Cut Width 0.1mm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product features cut-out processing of SUS304 material. It has undergone microfabrication with a cut width of 0.1mm, and we can also accommodate trimming of irregular shapes. By using ultrashort pulse lasers, we have significantly reduced physical damage and thermal effects, enabling fine processing with minimal burrs. ◆ Microfabrication of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Processing Contract
  • Other Auto Parts
  • Other semiconductor manufacturing equipment
  • Laser Micromachining

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Microfabrication, trimming, micron level, polyimide.

Microfabrication, trimming, micron level, polyimide.

Laser microfabrication: Trimming of polyimide using ultrashort pulse lasers.

【Microfabrication Trimming Micron Level Polyimide】 【Material】 Polyimide 【Industry and Applications】 Semiconductors Electronic Components 【Material Dimensions】 Plate Thickness: 25μm Remaining Width: 10μm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product is made of polyimide material. Trimming processing was performed on polyimide with a thickness of 25μm. The remaining width is 10μm. Since this product uses ultrashort pulse lasers, physical damage and thermal effects are greatly minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor components ◆ Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Tokatsu Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Wafer
  • Processing Contract
  • Other semiconductors
  • Laser Micromachining

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Microhole processing, micron level, material SUS304, stainless steel microprocessing.

Microhole processing, micron level, material SUS304, stainless steel microprocessing.

Cutting of stainless steel using ultrashort pulse laser processing.

【Material】 SUS304 (sus304) 【Industry and Application】 Automotive industry Medical devices and medical parts industry Precision stainless steel micro parts for medical devices 【Dimensions】 Thickness 0.5mm (500μm) 【Processing】 Ultrashort pulse laser processing 【Features】 This product is a precision part made from SUS304 (sus304) stainless steel, processed through fine cutting. The material is cut from 0.5mm thick stainless steel with a cutting width of 0.1mm (100μm). For size comparison, a hair is placed above it. This product utilizes ultrashort pulse laser technology, which significantly reduces physical damage and thermal effects, allowing for fine processing with minimal burrs.

  • Other Auto Parts
  • Laser Micromachining

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【QRコード　超短パルスレーザー　ガラス表面・内部改質加工】

【QRコード　超短パルスレーザー　ガラス表面・内部改質加工】

表面マーキング・内部改質加工（QRコード）　超短パルスレーザー

【QRコード　　超短パルスレーザー　　ガラス表面・内部改質加工】 【材質】 ソーダライム（青板ガラス）　厚み：1.3mm 【業界・使用用途】 自動車関連業界 医療機器・医療部品関連業界 半導体微細部品 【材寸】 加工サイズ：上段　表面マーキング　下段：内部改質　 【加工】 超短パルスレーザー加工 【特徴】 こちらの製品は、超短パルスレーザーでガラス表面を傷つけることなく、内部改質加工を 行いました。光の当たり方により虹色に見えます。 上段の白く見えるのがガラス表面にマーキング、下段の虹色に見えるのがガラス内部に マーキングしています。

  • 2D Code Reader
  • Laser Micromachining

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【ガラス　合成石英ガラス　レーザー改質　くり抜き加工】

【ガラス　合成石英ガラス　レーザー改質　くり抜き加工】

ガラス材への角窓くり抜き加工

材質】 合成石英ガラス　厚み：1mm 【業界・使用用途】 自動車関連業界 医療機器・医療部品関連業界 半導体・電子部品 【材寸】 加工サイズ：角窓寸法　3mm角～0.25mm角　 【加工】 超短パルスレーザー+ウェットエッチング 【特徴】 こちらの製品は、合成石英ガラスを角形状にくり抜きました。 超短パルスレーザーによるレーザー改質とウェットエッチングを組合せる事で角形状のくり抜きも可能となります。

  • Other electronic parts
  • Laser Micromachining

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Fine cutting processing SUS304 Contract processing Stainless fine processing

Fine cutting processing SUS304 Contract processing Stainless fine processing

Realization of fine cutting processing.

【Material and Processing】 SUS304 Thickness: 0.05mm Cutting Width: 0.1mm Cut-out Processing 【Features】 This product has undergone fine shape processing of thin film materials using ultra-short pulse laser. It is expected to be processed for miniaturization of parts and for incorporation into stacked products.

  • Other electronic parts
  • Laser Micromachining

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We processed a QR code onto aluminum foil using fine laser processing!

We processed a QR code onto aluminum foil using fine laser processing!

We processed a QR code onto a thin aluminum foil using fine laser machining.

【Industry and Application】 Automotive-related industry Medical devices and medical parts-related industry Precision stainless steel parts for medical devices 【Material】 Aluminum foil, thickness: 11μm 【Dimensions】 Processing size: 3mm x 3mm square range 【Processing】 Ultrashort pulse laser processing 【Features】 This product has a QR code laser-processed onto aluminum foil material. Please try scanning it! Our fine laser processing minimizes thermal impact on thin materials with a thickness of 11μm, allowing for clean processing. Physical damage and thermal effects are significantly reduced, enabling fine processing with minimal burrs.

  • others
  • Laser Micromachining

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